T-6000L/G
Travel Range with Wafer: 410 mm x 420 mm
Wafer Size: 2” – 8” (Ring & Frame)
Travel Range w/o Wafer: 550 mm x 420 mm
Z-Movement: 100 mm
Chip Rotation max.: up to 360°
Bond Force Range: 10 g – up to 10.000 g
Axis Speed: up to 1.8 m/sec
Placement Accuracy: 2.5 μm @ 3 sigma
Axis Resolution: XYZ: 0.01 μm, Theta: 0.01°
Min./Max. Component Size: 80 μm – 100 mm
T-8000
Travel Range with Wafer: 590 mm x 560 mm
Wafer Size: 2” – 12” (Ring & Frame)
Travel Range w/o Wafer: 740 mm x 560 mm
Z-Movement: 120 mm
Chip Rotation max.: up to 360°
Bond Force Range: 10 g – up to 10.000 g
Axis Speed: up to 1.8 m/sec
Placement Accuracy: 2.5 μm @ 3 sigma
Axis Resolution: XYZ: 0.01 μm, Theta: 0.01°
Min./Max. component size: 80 μm – 100 mm
Option
Tresky Automatic Die-bonder는 다양한 Application을 통해서 Full Automatic line까지 적용이 가능합니다.
Application에 맞는 Option이 추가로 필요하시다면 언제든지 문의 바랍니다.
